Government Opens HELB Funding Applications for First-Year and Continuing Students

0
The Government has opened HELB loan and scholarship applications for first-year and continuing university and TVET students under the 2026/27 funding cycle.
The Government has opened HELB loan and scholarship applications for first-year and continuing university and TVET students under the 2026/27 funding cycle. Photo/Courtesy

NAIROBI, Kenya – The Government has opened applications for Higher Education Loans Board (HELB) loans and scholarships for first-year and continuing university and Technical and Vocational Education and Training (TVET) students under the 2026/27 academic year.

Education Cabinet Secretary Julius Ogamba announced the reopening of the Higher Education Financing (HEF) portal during the Kenya Universities and Colleges Central Placement Service (KUCCPS) Stakeholder Forum, where the Ministry of Education released the 2026 university placement results.

“Following the conclusion of the placement process, the higher education financing portal is now open for application by first-time applicants, available at www.hef.co.ke or www.helb.co.ke,” Ogamba said.

He urged all students who have secured university or TVET placements and require financial support to submit their applications as soon as possible.

Separately, HELB announced that applications for subsequent undergraduate loans are now open for continuing students pursuing their second, third or fourth year of study, depending on their programme duration.

“Ready to continue your educational journey? The Higher Education Loans Board (HELB) is pleased to announce that applications for the Undergraduate Subsequent Loan are now open,” the board said in a statement.

More than 400,000 continuing undergraduate students in public and private universities are expected to benefit from the funding programme this academic year.

The support is backed by a record Sh56.3 billion allocation under the 2026/27 Budget, including KSh30 billion earmarked specifically for university scholarships as the Government seeks to expand access to higher education financing.

Continuing students can submit their applications through the HELB Mobile App or by dialling the USSD code *642#.

Applicants using the USSD platform are required to dial *642# on their registered mobile number, log in or register using their personal details, create a secure four-digit PIN, select the subsequent loan application option, complete the application process and await a confirmation SMS containing a serial number.

Those applying through the HELB Mobile App can download the application from the Google Play Store, register or log in using their registered phone number, select the appropriate loan product, complete the required financial literacy questions, choose a preferred payment option and submit the application electronically.

The opening of the application portals follows the release of the 2026 university placement results and marks the beginning of the Government’s student-centred funding process for the new academic year.

LEAVE A REPLY

Please enter your comment!
Please enter your name here